2N5551
vs
2N5551,412
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MICRO COMMERCIAL COMPONENTS CORP
|
NXP SEMICONDUCTORS
|
| Part Package Code |
TO-92
|
TO-92
|
| Package Description |
PLASTIC PACKAGE-3
|
CYLINDRICAL, O-PBCY-T3
|
| Pin Count |
3
|
3
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| Collector Current-Max (IC) |
0.6 A
|
0.6 A
|
| Collector-Emitter Voltage-Max |
160 V
|
160 V
|
| Configuration |
SINGLE
|
SINGLE
|
| DC Current Gain-Min (hFE) |
80
|
30
|
| JEDEC-95 Code |
TO-92
|
TO-92
|
| JESD-30 Code |
O-PBCY-T3
|
O-PBCY-T3
|
| JESD-609 Code |
e0
|
e3
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
3
|
3
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
CYLINDRICAL
|
CYLINDRICAL
|
| Peak Reflow Temperature (Cel) |
240
|
|
| Power Dissipation-Max (Abs) |
0.625 W
|
0.35 W
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
NO
|
NO
|
| Terminal Finish |
TIN LEAD
|
MATTE TIN
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Transistor Application |
AMPLIFIER
|
SWITCHING
|
| Transistor Element Material |
SILICON
|
SILICON
|
| Transition Frequency-Nom (fT) |
100 MHz
|
100 MHz
|
| Base Number Matches |
11
|
1
|
| Collector-Base Capacitance-Max |
|
6 pF
|
| Polarity/Channel Type |
|
NPN
|
| VCEsat-Max |
|
0.2 V
|
|
|
|
Compare 2N5551 with alternatives
Compare 2N5551,412 with alternatives
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2N5551,412 vs 2N5551,116
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-
2N5551,412 vs 2N5551STOB
-
2N5551,412 vs 2N5551G
-
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-
2N5551,412 vs 2N5551ZL1G
-
2N5551,412 vs 2N5551RLRE