2N5019
vs
TMPFJ177LO
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
CENTRAL SEMICONDUCTOR CORP
|
ALLEGRO MICROSYSTEMS LLC
|
| Part Package Code |
BCY
|
|
| Package Description |
TO-18, 3 PIN
|
SMALL OUTLINE, R-PDSO-G3
|
| Pin Count |
3
|
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| FET Technology |
JUNCTION
|
JUNCTION
|
| JEDEC-95 Code |
TO-18
|
TO-236AB
|
| JESD-30 Code |
O-MBCY-W3
|
R-PDSO-G3
|
| JESD-609 Code |
e0
|
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
3
|
3
|
| Operating Mode |
DEPLETION MODE
|
DEPLETION MODE
|
| Operating Temperature-Max |
200 °C
|
|
| Package Body Material |
METAL
|
PLASTIC/EPOXY
|
| Package Shape |
ROUND
|
RECTANGULAR
|
| Package Style |
CYLINDRICAL
|
SMALL OUTLINE
|
| Polarity/Channel Type |
P-CHANNEL
|
P-CHANNEL
|
| Power Dissipation-Max (Abs) |
1.8 W
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
NO
|
YES
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Terminal Form |
WIRE
|
GULL WING
|
| Terminal Position |
BOTTOM
|
DUAL
|
| Transistor Element Material |
SILICON
|
SILICON
|
| Base Number Matches |
1
|
1
|
| Configuration |
|
SINGLE
|
| Drain-source On Resistance-Max |
|
300 Ω
|
|
|
|
Compare 2N5019 with alternatives
Compare TMPFJ177LO with alternatives