28LV64AF30/SO vs 28LV64A30/VS feature comparison

28LV64AF30/SO Microchip Technology Inc

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28LV64A30/VS Microchip Technology Inc

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROCHIP TECHNOLOGY INC
Part Package Code SOIC SOIC
Package Description PLASTIC, SOIC-28 8 X 13.40 MM, VSOP-28
Pin Count 28 28
Reach Compliance Code unknown unknown
Access Time-Max 300 ns 300 ns
JESD-30 Code R-PDSO-G28 R-PDSO-G28
Memory Density 65536 bit 65536 bit
Memory IC Type EEPROM EEPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 8192 words 8192 words
Number of Words Code 8000 8000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 8KX8 8KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 3 V 3 V
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Base Number Matches 1 1
Pbfree Code No
Rohs Code No
Command User Interface NO
Data Polling YES
JESD-609 Code e0
Package Equivalence Code TSSOP28,.53,22
Peak Reflow Temperature (Cel) NOT SPECIFIED
Power Supplies 3/3.3 V
Ready/Busy YES
Standby Current-Max 0.0001 A
Supply Current-Max 0.008 mA
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Pitch 0.55 mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Toggle Bit NO
Write Cycle Time-Max (tWC) 3 ms

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