28LV64AF-30I/P
vs
28LV64A30/P
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Part Package Code |
DIP
|
DIP
|
Package Description |
0.600 INCH, PLASTIC, DIP-28
|
PLASTIC, DIP-28
|
Pin Count |
28
|
28
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.32.00.51
|
|
Access Time-Max |
300 ns
|
300 ns
|
Additional Feature |
AUTOMATIC WRITE
|
|
Command User Interface |
NO
|
|
Data Polling |
YES
|
|
JESD-30 Code |
R-PDIP-T28
|
R-PDIP-T28
|
Length |
35.43 mm
|
|
Memory Density |
65536 bit
|
65536 bit
|
Memory IC Type |
EEPROM
|
EEPROM
|
Memory Width |
8
|
8
|
Number of Functions |
1
|
1
|
Number of Terminals |
28
|
28
|
Number of Words |
8192 words
|
8192 words
|
Number of Words Code |
8000
|
8000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
Organization |
8KX8
|
8KX8
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
DIP
|
Package Equivalence Code |
DIP28,.6
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Programming Voltage |
3 V
|
3 V
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Ready/Busy |
YES
|
|
Seated Height-Max |
4.7 mm
|
|
Standby Current-Max |
0.0001 A
|
|
Supply Current-Max |
0.008 mA
|
|
Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
|
Terminal Position |
DUAL
|
DUAL
|
Toggle Bit |
NO
|
|
Width |
15.24 mm
|
|
Write Cycle Time-Max (tWC) |
0.2 ms
|
|
Base Number Matches |
1
|
1
|
Output Characteristics |
|
3-STATE
|
|
|
|
Compare 28LV64AF-30I/P with alternatives
Compare 28LV64A30/P with alternatives