28LV64AF-30I/P vs 28LV64A30/P feature comparison

28LV64AF-30I/P Microchip Technology Inc

Buy Now Datasheet

28LV64A30/P Microchip Technology Inc

Buy Now Datasheet
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROCHIP TECHNOLOGY INC
Part Package Code DIP DIP
Package Description 0.600 INCH, PLASTIC, DIP-28 PLASTIC, DIP-28
Pin Count 28 28
Reach Compliance Code unknown unknown
ECCN Code EAR99
HTS Code 8542.32.00.51
Access Time-Max 300 ns 300 ns
Additional Feature AUTOMATIC WRITE
Command User Interface NO
Data Polling YES
JESD-30 Code R-PDIP-T28 R-PDIP-T28
Length 35.43 mm
Memory Density 65536 bit 65536 bit
Memory IC Type EEPROM EEPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 8192 words 8192 words
Number of Words Code 8000 8000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 8KX8 8KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP28,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 3 V 3 V
Qualification Status Not Qualified Not Qualified
Ready/Busy YES
Seated Height-Max 4.7 mm
Standby Current-Max 0.0001 A
Supply Current-Max 0.008 mA
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Toggle Bit NO
Width 15.24 mm
Write Cycle Time-Max (tWC) 0.2 ms
Base Number Matches 1 1
Output Characteristics 3-STATE

Compare 28LV64AF-30I/P with alternatives

Compare 28LV64A30/P with alternatives