28LV64A30/P
vs
CAT28LV65HPI-30
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
ON SEMICONDUCTOR
Part Package Code
DIP
DIP
Package Description
PLASTIC, DIP-28
0.600 INCH, PLASTIC, DIP-28
Pin Count
28
28
Reach Compliance Code
unknown
compliant
Access Time-Max
300 ns
300 ns
JESD-30 Code
R-PDIP-T28
R-PDIP-T28
Memory Density
65536 bit
65536 bit
Memory IC Type
EEPROM
EEPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
28
28
Number of Words
8192 words
8192 words
Number of Words Code
8000
8000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
8KX8
8KX8
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
3 V
3 V
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
3 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Base Number Matches
1
2
Pbfree Code
Rohs Code
ECCN Code
EAR99
HTS Code
8542.32.00.51
JESD-609 Code
e0
Length
36.703 mm
Seated Height-Max
5.08 mm
Supply Current-Max
0.008 mA
Terminal Finish
TIN LEAD
Terminal Pitch
2.54 mm
Width
15.24 mm
Write Cycle Time-Max (tWC)
5 ms
Compare 28LV64A30/P with alternatives
Compare CAT28LV65HPI-30 with alternatives