28LV64A--30I/L
vs
28LV64AF30/L
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
QFJ
|
QFJ
|
| Package Description |
QCCJ,
|
PLASTIC, LCC-32
|
| Pin Count |
32
|
32
|
| Reach Compliance Code |
unknown
|
unknown
|
| Access Time-Max |
300 ns
|
300 ns
|
| Additional Feature |
MINIMUM 100K WRITE/ERASE CYCLE; 200 YEAR DATA RETENTION
|
|
| JESD-30 Code |
R-PQCC-J32
|
R-PQCC-J32
|
| Length |
13.97 mm
|
|
| Memory Density |
65536 bit
|
65536 bit
|
| Memory IC Type |
EEPROM
|
EEPROM
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
32
|
32
|
| Number of Words |
8192 words
|
8192 words
|
| Number of Words Code |
8000
|
8000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
8KX8
|
8KX8
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
QCCJ
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Programming Voltage |
3 V
|
3 V
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
3.56 mm
|
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Form |
J BEND
|
J BEND
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
11.43 mm
|
|
| Write Cycle Time-Max (tWC) |
3 ms
|
|
| Base Number Matches |
3
|
3
|
| Output Characteristics |
|
3-STATE
|
|
|
|
Compare 28LV64A--30I/L with alternatives
Compare 28LV64AF30/L with alternatives