28C256-15I/J
vs
X28HC256JZ-15
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
INTERSIL CORP
|
| Part Package Code |
DIP
|
PDIP, PLCC, SOIC
|
| Package Description |
0.600 INCH, CERDIP-28
|
QCCJ, LDCC32,.5X.6
|
| Pin Count |
28
|
28, 32, 28
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Access Time-Max |
150 ns
|
150 ns
|
| Additional Feature |
AUTOMATIC WRITE
|
|
| Command User Interface |
NO
|
NO
|
| Data Polling |
YES
|
YES
|
| Endurance |
10000 Write/Erase Cycles
|
1000000 Write/Erase Cycles
|
| JESD-30 Code |
R-GDIP-T28
|
R-PQCC-J32
|
| JESD-609 Code |
e0
|
e3
|
| Length |
36.83 mm
|
13.97 mm
|
| Memory Density |
262144 bit
|
262144 bit
|
| Memory IC Type |
EEPROM
|
EEPROM
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
28
|
32
|
| Number of Words |
32768 words
|
32768 words
|
| Number of Words Code |
32000
|
32000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
32KX8
|
32KX8
|
| Output Characteristics |
3-STATE
|
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
QCCJ
|
| Package Equivalence Code |
DIP28,.6
|
LDCC32,.5X.6
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
CHIP CARRIER
|
| Page Size |
64 words
|
128 words
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Programming Voltage |
5 V
|
5 V
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.461 mm
|
3.55 mm
|
| Standby Current-Max |
0.001 A
|
0.0005 A
|
| Supply Current-Max |
0.07 mA
|
0.06 mA
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
MATTE TIN
|
| Terminal Form |
THROUGH-HOLE
|
J BEND
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Toggle Bit |
YES
|
YES
|
| Width |
15.24 mm
|
11.43 mm
|
| Write Cycle Time-Max (tWC) |
2 ms
|
5 ms
|
| Base Number Matches |
1
|
2
|
| Factory Lead Time |
|
26 Weeks
|
| Moisture Sensitivity Level |
|
3
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare 28C256-15I/J with alternatives
Compare X28HC256JZ-15 with alternatives