27LV64T-25I/L vs AM27C64-255JC feature comparison

27LV64T-25I/L Microchip Technology Inc

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AM27C64-255JC Teledyne e2v

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer MICROCHIP TECHNOLOGY INC TELEDYNE E2V (UK) LTD
Part Package Code QFJ
Package Description PLASTIC, LCC-32 LCC-32
Pin Count 32
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.61
Access Time-Max 250 ns 250 ns
JESD-30 Code R-PQCC-J32 R-PQCC-J32
Length 13.97 mm 13.97 mm
Memory Density 65536 bit 65536 bit
Memory IC Type OTP ROM UVPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 8192 words 8192 words
Number of Words Code 8000 8000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 8KX8 8KX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ QCCJ
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified
Seated Height-Max 3.556 mm 3.556 mm
Supply Voltage-Max (Vsup) 5.5 V 5.25 V
Supply Voltage-Min (Vsup) 3 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form J BEND J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Width 11.43 mm 11.43 mm
Base Number Matches 1 4
Supply Current-Max 0.025 mA

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