27HC256T-55/L vs AM27C256-55JC feature comparison

27HC256T-55/L Microchip Technology Inc

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AM27C256-55JC Rochester Electronics LLC

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Contact Manufacturer Active
Ihs Manufacturer MICROCHIP TECHNOLOGY INC ROCHESTER ELECTRONICS LLC
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 170 ns 80 ns
I/O Type COMMON
JESD-30 Code R-PQCC-J32 R-PQCC-J32
JESD-609 Code e0
Memory Density 262144 bit 256 bit
Memory IC Type OTP ROM OTP ROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 32768 words 32768 words
Number of Words Code 32000 32
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 32KX8 32X8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ QCCJ
Package Equivalence Code LDCC32,.5X.6
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 13 V
Qualification Status Not Qualified
Standby Current-Max 0.035 A
Supply Current-Max 0.03 mA 0.03 mA
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form J BEND J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Base Number Matches 1 3
Package Description QCCJ,
Length 13.97 mm
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 3.55 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 11.43 mm

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