27HC256-90/L vs IS27LV256-90PL feature comparison

27HC256-90/L Microchip Technology Inc

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IS27LV256-90PL Integrated Silicon Solution Inc

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICROCHIP TECHNOLOGY INC INTEGRATED SILICON SOLUTION INC
Part Package Code QFJ QFJ
Package Description PLASTIC, LCC-32 PLASTIC, LCC-32
Pin Count 32 32
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 90 ns 90 ns
JESD-30 Code R-PQCC-J32 R-PQCC-J32
Memory Density 262144 bit 262144 bit
Memory IC Type OTP ROM OTP ROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 32KX8 32KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ QCCJ
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 3.6 V
Supply Voltage-Min (Vsup) 4.5 V 2.7 V
Supply Voltage-Nom (Vsup) 5 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form J BEND J BEND
Terminal Position QUAD QUAD
Base Number Matches 1 2
Rohs Code No
I/O Type COMMON
JESD-609 Code e0
Length 13.97 mm
Package Equivalence Code LDCC32,.5X.6
Programming Voltage 12.5 V
Seated Height-Max 3.55 mm
Standby Current-Max 0.00002 A
Supply Current-Max 0.008 mA
Terminal Finish TIN LEAD
Terminal Pitch 1.27 mm
Width 11.43 mm

Compare 27HC256-90/L with alternatives

Compare IS27LV256-90PL with alternatives