27HC1616-45/J
vs
CY7C273-45DMB
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
CYPRESS SEMICONDUCTOR CORP
Part Package Code
DIP
DIP
Package Description
0.600 INCH, WINDOWED, CERDIP-40
0.600 INCH, CERDIP-40
Pin Count
40
40
Reach Compliance Code
unknown
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.61
8542.32.00.71
Access Time-Max
45 ns
45 ns
I/O Type
COMMON
COMMON
JESD-30 Code
R-GDIP-T40
R-GDIP-T40
JESD-609 Code
e0
e0
Length
52.07 mm
Memory Density
262144 bit
262144 bit
Memory IC Type
UVPROM
OTP ROM
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
40
40
Number of Words
16384 words
16384 words
Number of Words Code
16000
16000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Organization
16KX16
16KX16
Output Characteristics
3-STATE
3-STATE
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
WDIP
DIP
Package Equivalence Code
DIP40,.6
DIP40,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE, WINDOW
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.715 mm
Standby Current-Max
0.05 A
0.05 A
Supply Current-Max
0.13 mA
0.25 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
MILITARY
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
15.24 mm
Base Number Matches
1
1
Additional Feature
POWER SWITCHED PROM
Screening Level
38535Q/M;38534H;883B
Compare 27HC1616-45/J with alternatives
Compare CY7C273-45DMB with alternatives