27C64MEQ7B/Y25 vs 27C64-25/K feature comparison

27C64MEQ7B/Y25 Thales Group

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27C64-25/K Microchip Technology Inc

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer THOMSON-CSF SEMICONDUCTORS MICROCHIP TECHNOLOGY INC
Part Package Code QFJ QFJ
Package Description , CERAMIC, LCC-32
Pin Count 32 32
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C EAR99
HTS Code 8542.32.00.61 8542.32.00.61
Access Time-Max 250 ns 250 ns
JESD-30 Code R-CQCC-N32 R-CQCC-N32
Memory Density 65536 bit 65536 bit
Memory IC Type UVPROM EPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 8192 words 8192 words
Number of Words Code 8000 8000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Organization 8KX8 8KX8
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level CECC90000B
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY COMMERCIAL
Terminal Form NO LEAD NO LEAD
Terminal Position QUAD QUAD
Base Number Matches 2 1
Pbfree Code No
Rohs Code No
I/O Type COMMON
JESD-609 Code e0
Length 13.97 mm
Output Characteristics 3-STATE
Package Code QCCN
Package Equivalence Code LCC32,.45X.55
Programming Voltage 13 V
Seated Height-Max 3.048 mm
Standby Current-Max 0.0001 A
Supply Current-Max 0.02 mA
Terminal Finish TIN LEAD
Terminal Pitch 1.27 mm
Width 11.43 mm

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