27C256/BXA-20
vs
NM27C256NE200
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
PHILIPS SEMICONDUCTORS
FAIRCHILD SEMICONDUCTOR CORP
Package Description
DIP, DIP28,.6
DIP, DIP28,.6
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
EAR99
HTS Code
8542.32.00.61
8542.32.00.71
Access Time-Max
200 ns
200 ns
I/O Type
COMMON
COMMON
JESD-30 Code
R-XDIP-T28
R-PDIP-T28
JESD-609 Code
e0
e0
Memory Density
262144 bit
262144 bit
Memory Width
8
8
Number of Terminals
28
28
Number of Words
32768 words
32768 words
Number of Words Code
32000
32000
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Organization
32KX8
32KX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
CERAMIC
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP28,.6
DIP28,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Programming Voltage
12.5 V
12.75 V
Qualification Status
Not Qualified
Not Qualified
Screening Level
38535Q/M;38534H;883B
Standby Current-Max
0.0001 A
0.0001 A
Supply Current-Max
0.03 mA
0.035 mA
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
2
3
Part Package Code
DIP
Pin Count
28
Length
35.942 mm
Memory IC Type
OTP ROM
Number of Functions
1
Operating Mode
ASYNCHRONOUS
Parallel/Serial
PARALLEL
Seated Height-Max
5.334 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Width
15.24 mm
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