27C040-150V10 vs 5962-9175204MXX feature comparison

27C040-150V10 Intel Corporation

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5962-9175204MXX e2v technologies

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEL CORP TELEDYNE E2V (UK) LTD
Part Package Code DIP DIP
Package Description WDIP, WINDOWED, CERAMIC, DIP-32
Pin Count 32 32
Reach Compliance Code unknown compliant
ECCN Code EAR99 3A001.A.2.C
HTS Code 8542.32.00.61 8542.32.00.61
Access Time-Max 150 ns 150 ns
JESD-30 Code R-GDIP-T32 R-GDIP-T32
Length 42.165 mm 42.1005 mm
Memory Density 4194304 bit 4194304 bit
Memory IC Type UVPROM UVPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 512KX8 512KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code WDIP WDIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE, WINDOW IN-LINE, WINDOW
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.72 mm 5.588 mm
Supply Current-Max 0.05 mA 0.06 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm 15.24 mm
Base Number Matches 2 1
Screening Level MIL-STD-883

Compare 27C040-150V10 with alternatives

Compare 5962-9175204MXX with alternatives