2612F
vs
2606B
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
SIGNETICS CORP
LSI CORP
Package Description
,
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
HTS Code
8542.32.00.41
Access Time-Max
400 ns
JESD-30 Code
R-GDIP-T16
Memory Density
1024 bit
Memory IC Type
STANDARD SRAM
Memory Width
4
Number of Functions
1
Number of Ports
1
Number of Terminals
16
Number of Words
256 words
Number of Words Code
256
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
256X4
Output Characteristics
3-STATE
Output Enable
NO
Package Body Material
CERAMIC, GLASS-SEALED
Package Code
DIP
Package Shape
RECTANGULAR
Package Style
IN-LINE
Parallel/Serial
PARALLEL
Qualification Status
Not Qualified
Supply Voltage-Max (Vsup)
5.25 V
Supply Voltage-Min (Vsup)
4.75 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
NO
Technology
NMOS
Temperature Grade
COMMERCIAL
Terminal Form
THROUGH-HOLE
Terminal Position
DUAL
Base Number Matches
3
8
Mounting Feature
THROUGH HOLE MOUNT
Optoelectronic Device Type
PIN PHOTODIODE
Semiconductor Material
InGaAs
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