2612F vs 2606B feature comparison

2612F NXP Semiconductors

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2606B LSI Corporation

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer SIGNETICS CORP LSI CORP
Package Description ,
Reach Compliance Code unknown unknown
ECCN Code EAR99
HTS Code 8542.32.00.41
Access Time-Max 400 ns
JESD-30 Code R-GDIP-T16
Memory Density 1024 bit
Memory IC Type STANDARD SRAM
Memory Width 4
Number of Functions 1
Number of Ports 1
Number of Terminals 16
Number of Words 256 words
Number of Words Code 256
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 256X4
Output Characteristics 3-STATE
Output Enable NO
Package Body Material CERAMIC, GLASS-SEALED
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 5.25 V
Supply Voltage-Min (Vsup) 4.75 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO NO
Technology NMOS
Temperature Grade COMMERCIAL
Terminal Form THROUGH-HOLE
Terminal Position DUAL
Base Number Matches 3 8
Mounting Feature THROUGH HOLE MOUNT
Optoelectronic Device Type PIN PHOTODIODE
Semiconductor Material InGaAs

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