25LC640AT-I/MF
vs
25LC640AX-E/SN
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Part Package Code
DFN
SOIC
Package Description
6 X 5 MM, LEAD FREE, PLASTIC, DFN-8
3.90 MM, LEAD FREE, PLASTIC, SOIC-8
Pin Count
8
8
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Clock Frequency-Max (fCLK)
10 MHz
10 MHz
Data Retention Time-Min
200
Endurance
1000000 Write/Erase Cycles
JESD-30 Code
R-PDSO-N8
R-PDSO-G8
JESD-609 Code
e3
e3
Length
5.99 mm
4.9 mm
Memory Density
65536 bit
65536 bit
Memory IC Type
EEPROM
EEPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
8
8
Number of Words
8192 words
8192 words
Number of Words Code
8000
8000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
8KX8
8KX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HVSON
SOP
Package Equivalence Code
SOLCC8,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
SMALL OUTLINE
Parallel/Serial
SERIAL
SERIAL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1 mm
1.75 mm
Serial Bus Type
SPI
SPI
Standby Current-Max
0.000001 A
Supply Current-Max
0.005 mA
0.005 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
2.5 V
2.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Finish
MATTE TIN
Matte Tin (Sn)
Terminal Form
NO LEAD
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
4.92 mm
3.9 mm
Write Cycle Time-Max (tWC)
5 ms
5 ms
Write Protection
HARDWARE/SOFTWARE
Base Number Matches
1
1
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
260
Time@Peak Reflow Temperature-Max (s)
40
Compare 25LC640AT-I/MF with alternatives
Compare 25LC640AX-E/SN with alternatives