25LC640AT-E/ST16KVAO
vs
25LC640AT-I/MNY
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
TSSOP-8
|
2 X 3 MM, 0.75 MM HEIGHT, PLASTIC, TDFN-8
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Clock Frequency-Max (fCLK) |
10 MHz
|
10 MHz
|
| Data Retention Time-Min |
200
|
200
|
| Endurance |
1000000 Write/Erase Cycles
|
1000000 Write/Erase Cycles
|
| JESD-30 Code |
R-PDSO-G8
|
R-PDSO-N8
|
| JESD-609 Code |
e3
|
e4
|
| Length |
4.4 mm
|
3 mm
|
| Memory Density |
65536 bit
|
65536 bit
|
| Memory IC Type |
EEPROM
|
EEPROM
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Ports |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Number of Words |
8192 words
|
8192 words
|
| Number of Words Code |
8000
|
8000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
8KX8
|
8KX8
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
HVSON
|
| Package Equivalence Code |
TSSOP8,.25
|
SOLCC8,.11,20
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE
|
| Parallel/Serial |
SERIAL
|
SERIAL
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
| Programming Voltage |
5 V
|
5 V
|
| Screening Level |
AEC-Q100; TS 16949
|
AEC-Q100
|
| Seated Height-Max |
1.2 mm
|
0.8 mm
|
| Serial Bus Type |
SPI
|
SPI
|
| Standby Current-Max |
0.000005 A
|
0.000001 A
|
| Supply Current-Max |
0.005 mA
|
0.005 mA
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2.5 V
|
2.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
| Terminal Finish |
Matte Tin (Sn)
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
0.65 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
40
|
| Width |
3 mm
|
2 mm
|
| Write Cycle Time-Max (tWC) |
5 ms
|
5 ms
|
| Write Protection |
HARDWARE
|
HARDWARE/SOFTWARE
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
Yes
|
| Part Package Code |
|
DFN
|
| Pin Count |
|
8
|
| Factory Lead Time |
|
18 Weeks
|
| Samacsys Manufacturer |
|
Microchip
|
| Moisture Sensitivity Level |
|
1
|
| Qualification Status |
|
Not Qualified
|
|
|
|
Compare 25LC640AT-E/ST16KVAO with alternatives
Compare 25LC640AT-I/MNY with alternatives