25LC160-I/P
vs
M24C32-WDW3G/P
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Not Recommended
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
STMICROELECTRONICS
|
| Part Package Code |
DIP
|
SOIC
|
| Package Description |
0.300 INCH, PLASTIC, MS-001, DIP-8
|
TSSOP, TSSOP8,.25
|
| Pin Count |
8
|
8
|
| Reach Compliance Code |
compliant
|
compliant
|
| Factory Lead Time |
4 Weeks
|
|
| Samacsys Manufacturer |
Microchip
|
|
| Clock Frequency-Max (fCLK) |
2 MHz
|
0.4 MHz
|
| Data Retention Time-Min |
200
|
40
|
| Endurance |
1000000 Write/Erase Cycles
|
1000000 Write/Erase Cycles
|
| JESD-30 Code |
R-PDIP-T8
|
R-PDSO-G8
|
| JESD-609 Code |
e3
|
e4
|
| Length |
9.46 mm
|
4.4 mm
|
| Memory Density |
16384 bit
|
32768 bit
|
| Memory IC Type |
EEPROM
|
EEPROM
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Number of Words |
2048 words
|
4096 words
|
| Number of Words Code |
2000
|
4000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
2KX8
|
4KX8
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
TSSOP
|
| Package Equivalence Code |
DIP8,.3
|
TSSOP8,.25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Parallel/Serial |
SERIAL
|
SERIAL
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
| Power Supplies |
3/5 V
|
3/5 V
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.32 mm
|
1.2 mm
|
| Serial Bus Type |
SPI
|
I2C
|
| Standby Current-Max |
0.000001 A
|
0.00001 A
|
| Supply Current-Max |
0.005 mA
|
0.005 mA
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2.5 V
|
2.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
2.7 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
| Terminal Finish |
Matte Tin (Sn)
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
30
|
| Width |
7.62 mm
|
3 mm
|
| Write Cycle Time-Max (tWC) |
5 ms
|
5 ms
|
| Write Protection |
HARDWARE/SOFTWARE
|
HARDWARE
|
| Base Number Matches |
1
|
1
|
| I2C Control Byte |
|
1010DDDR
|
| Moisture Sensitivity Level |
|
1
|
| Screening Level |
|
AEC-Q100
|
|
|
|
Compare 25LC160-I/P with alternatives
Compare M24C32-WDW3G/P with alternatives