25LC080DT-I/MNY vs 25LC080B-E/P feature comparison

25LC080DT-I/MNY Microchip Technology Inc

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25LC080B-E/P Microchip Technology Inc

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Not Recommended
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROCHIP TECHNOLOGY INC
Part Package Code DFN DIP
Package Description 2 X 3 MM, 0.75 MM HEIGHT, PLASTIC, TDFN-8 0.300 INCH, ROHS COMPLIANT, PLASTIC, DIP-8
Pin Count 8 8
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Factory Lead Time 6 Weeks 5 Weeks
Clock Frequency-Max (fCLK) 10 MHz 10 MHz
Data Retention Time-Min 200 200
Endurance 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles
JESD-30 Code R-PDSO-N8 R-PDIP-T8
JESD-609 Code e4 e3
Length 3 mm 9.271 mm
Memory Density 8192 bit 8192 bit
Memory IC Type EEPROM EEPROM
Memory Width 8 8
Moisture Sensitivity Level 1
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 8 8
Number of Words 1024 words 1024 words
Number of Words Code 1000 1000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Organization 1KX8 1KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HVSON DIP
Package Equivalence Code SOLCC8,.11,20 DIP8,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE IN-LINE
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) 260
Programming Voltage 5 V 5 V
Qualification Status Not Qualified Not Qualified
Screening Level AEC-Q100 TS 16949
Seated Height-Max 0.8 mm 5.334 mm
Serial Bus Type SPI SPI
Standby Current-Max 0.000001 A 0.000005 A
Supply Current-Max 0.005 mA 0.006 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 2.5 V 2.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) MATTE TIN
Terminal Form NO LEAD THROUGH-HOLE
Terminal Pitch 0.5 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 40
Width 2 mm 7.62 mm
Write Cycle Time-Max (tWC) 5 ms 5 ms
Write Protection HARDWARE/SOFTWARE HARDWARE
Base Number Matches 1 1

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