25AA640AXT-E/ST
vs
25AA640/PG
feature comparison
Part Life Cycle Code |
Active
|
Not Recommended
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.51
|
8542.32.00.51
|
Memory IC Type |
EEPROM
|
EEPROM
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
Serial Bus Type |
SPI
|
SPI
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
Yes
|
Rohs Code |
|
Yes
|
Part Package Code |
|
DIP
|
Package Description |
|
0.300 INCH, PLASTIC, DIP-8
|
Pin Count |
|
8
|
Additional Feature |
|
DATA RETENTION > 200 YEARS; 4KV ESD PROTECTION; 1M ENDURANCE CYCLES
|
Clock Frequency-Max (fCLK) |
|
1 MHz
|
Data Retention Time-Min |
|
200
|
Endurance |
|
1000000 Write/Erase Cycles
|
JESD-30 Code |
|
R-PDIP-T8
|
JESD-609 Code |
|
e3
|
Length |
|
9.46 mm
|
Memory Density |
|
65536 bit
|
Memory Width |
|
8
|
Number of Functions |
|
1
|
Number of Terminals |
|
8
|
Number of Words |
|
8192 words
|
Number of Words Code |
|
8000
|
Operating Mode |
|
SYNCHRONOUS
|
Operating Temperature-Max |
|
70 °C
|
Operating Temperature-Min |
|
|
Organization |
|
8KX8
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Code |
|
DIP
|
Package Shape |
|
RECTANGULAR
|
Package Style |
|
IN-LINE
|
Parallel/Serial |
|
SERIAL
|
Qualification Status |
|
Not Qualified
|
Seated Height-Max |
|
4.32 mm
|
Supply Voltage-Max (Vsup) |
|
5.5 V
|
Supply Voltage-Min (Vsup) |
|
1.8 V
|
Supply Voltage-Nom (Vsup) |
|
2.5 V
|
Surface Mount |
|
NO
|
Technology |
|
CMOS
|
Temperature Grade |
|
COMMERCIAL
|
Terminal Finish |
|
MATTE TIN
|
Terminal Form |
|
THROUGH-HOLE
|
Terminal Pitch |
|
2.54 mm
|
Terminal Position |
|
DUAL
|
Width |
|
7.62 mm
|
Write Cycle Time-Max (tWC) |
|
5 ms
|
|
|
|
Compare 25AA640AXT-E/ST with alternatives
Compare 25AA640/PG with alternatives