25AA640A-I/MNY
vs
25AA640X/STG
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Not Recommended
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Part Package Code
DFN
SOIC
Package Description
2 X 3 MM, 0.75 MM HEIGHT, PLASTIC, TDFN-8
TSSOP-8
Pin Count
8
8
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Clock Frequency-Max (fCLK)
10 MHz
1 MHz
Data Retention Time-Min
200
200
Endurance
1000000 Write/Erase Cycles
1000000 Write/Erase Cycles
JESD-30 Code
R-PDSO-N8
R-PDSO-G8
JESD-609 Code
e4
e3
Length
3 mm
4.4 mm
Memory Density
65536 bit
65536 bit
Memory IC Type
EEPROM
EEPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
8
8
Number of Words
8192 words
8192 words
Number of Words Code
8000
8000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
8KX8
8KX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HVSON
TSSOP
Package Equivalence Code
SOLCC8,.11,20
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial
SERIAL
SERIAL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
0.8 mm
1.2 mm
Serial Bus Type
SPI
SPI
Standby Current-Max
0.000001 A
Supply Current-Max
0.005 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
1.8 V
1.8 V
Supply Voltage-Nom (Vsup)
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Matte Tin (Sn)
Terminal Form
NO LEAD
GULL WING
Terminal Pitch
0.5 mm
0.65 mm
Terminal Position
DUAL
DUAL
Width
2 mm
3 mm
Write Cycle Time-Max (tWC)
5 ms
5 ms
Write Protection
HARDWARE/SOFTWARE
Base Number Matches
1
1
Pbfree Code
Rohs Code
Additional Feature
DATA RETENTION > 200 YEARS; 4KV ESD PROTECTION; 1M ENDURANCE CYCLES
Moisture Sensitivity Level
1
Compare 25AA640A-I/MNY with alternatives
Compare 25AA640X/STG with alternatives