25AA256-I/P
vs
25AA256XT-I/MF
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Part Package Code
DIP
DFN
Package Description
0.300 INCH, ROHS COMPLIANT, PLASTIC, DIP-8
6 X 5 MM, PLASTIC, DFN-8
Pin Count
8
8
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Factory Lead Time
4 Weeks
Samacsys Manufacturer
Microchip
Clock Frequency-Max (fCLK)
10 MHz
10 MHz
Data Retention Time-Min
200
Endurance
1000000 Write/Erase Cycles
JESD-30 Code
R-PDIP-T8
R-PDSO-N8
JESD-609 Code
e3
e3
Length
9.271 mm
5.99 mm
Memory Density
262144 bit
262144 bit
Memory IC Type
EEPROM
EEPROM
Memory Width
8
8
Number of Functions
1
1
Number of Ports
1
Number of Terminals
8
8
Number of Words
32768 words
32768 words
Number of Words Code
32000
32000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
32KX8
32KX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
VSON
Package Equivalence Code
DIP8,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE, VERY THIN PROFILE
Parallel/Serial
SERIAL
SERIAL
Programming Voltage
2.5 V
Qualification Status
Not Qualified
Not Qualified
Screening Level
AEC-Q100
Seated Height-Max
5.334 mm
1 mm
Serial Bus Type
SPI
SPI
Standby Current-Max
0.000001 A
Supply Current-Max
0.006 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
1.8 V
1.8 V
Supply Voltage-Nom (Vsup)
2.5 V
2.5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
MATTE TIN
MATTE TIN
Terminal Form
THROUGH-HOLE
NO LEAD
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
4.92 mm
Write Cycle Time-Max (tWC)
5 ms
5 ms
Write Protection
HARDWARE/SOFTWARE
Base Number Matches
2
1
Moisture Sensitivity Level
1
Compare 25AA256-I/P with alternatives
Compare 25AA256XT-I/MF with alternatives