25AA160D-I/S16K
vs
25AA160/PB61
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Not Recommended
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Package Description
DIE,
0.300 INCH, PLASTIC, DIP-8
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Clock Frequency-Max (fCLK)
10 MHz
1 MHz
Data Retention Time-Min
200
Endurance
1000000 Write/Erase Cycles
JESD-30 Code
R-XUUC-N
R-PDIP-T8
Memory Density
16384 bit
16384 bit
Memory IC Type
EEPROM
EEPROM
Memory Width
8
8
Number of Functions
1
1
Number of Ports
1
Number of Words
2048 words
2048 words
Number of Words Code
2000
2000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
2KX8
2KX8
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Code
DIE
DIP
Package Equivalence Code
DIE OR CHIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
UNCASED CHIP
IN-LINE
Parallel/Serial
SERIAL
SERIAL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Programming Voltage
2.5 V
Screening Level
TS 16949
Serial Bus Type
SPI
SPI
Standby Current-Max
0.000001 A
Supply Current-Max
0.005 mA
0.005 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
1.8 V
1.8 V
Supply Voltage-Nom (Vsup)
2.5 V
2.5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Form
NO LEAD
THROUGH-HOLE
Terminal Position
UPPER
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Write Cycle Time-Max (tWC)
5 ms
5 ms
Write Protection
HARDWARE
Base Number Matches
1
1
Pbfree Code
Rohs Code
Part Package Code
DIP
Pin Count
8
JESD-609 Code
e3
Length
9.2 mm
Number of Terminals
8
Qualification Status
Not Qualified
Terminal Finish
MATTE TIN
Width
7.62 mm
Compare 25AA160D-I/S16K with alternatives
Compare 25AA160/PB61 with alternatives