25AA160B-I/WF15K
vs
25AA160/SNB63
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Not Recommended
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Package Description
WAFER
0.150 INCH, PLASTIC, SOIC-8
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Additional Feature
ALSO OPERATES WITH 1.8VMIN@3MHZ
Clock Frequency-Max (fCLK)
10 MHz
1 MHz
Data Retention Time-Min
200
Endurance
1000000 Write/Erase Cycles
JESD-30 Code
R-XUUC-N
R-PDSO-G8
Memory Density
16384 bit
16384 bit
Memory IC Type
EEPROM
EEPROM
Memory Width
8
8
Number of Functions
1
1
Number of Ports
1
Number of Words
2048 words
2048 words
Number of Words Code
2000
2000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
2KX8
2KX8
Output Characteristics
3-STATE
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Code
DIE
SOP
Package Equivalence Code
DIE OR CHIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
UNCASED CHIP
SMALL OUTLINE
Parallel/Serial
SERIAL
SERIAL
Programming Voltage
5 V
Screening Level
TS 16949
Serial Bus Type
SPI
SPI
Standby Current-Max
0.000001 A
Supply Current-Max
0.006 mA
0.005 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
1.8 V
Supply Voltage-Nom (Vsup)
5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Form
NO LEAD
GULL WING
Terminal Position
UPPER
DUAL
Write Cycle Time-Max (tWC)
5 ms
5 ms
Write Protection
HARDWARE
Base Number Matches
1
1
Pbfree Code
Rohs Code
Part Package Code
SOIC
Pin Count
8
JESD-609 Code
e3
Length
4.9 mm
Moisture Sensitivity Level
1
Number of Terminals
8
Qualification Status
Not Qualified
Terminal Finish
Matte Tin (Sn)
Terminal Pitch
1.27 mm
Width
3.9 mm
Compare 25AA160B-I/WF15K with alternatives
Compare 25AA160/SNB63 with alternatives