25AA160/PB61
vs
25AA160/SNB63
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Not Recommended
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Part Package Code
DIP
SOIC
Package Description
0.300 INCH, PLASTIC, DIP-8
0.150 INCH, PLASTIC, SOIC-8
Pin Count
8
8
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Clock Frequency-Max (fCLK)
1 MHz
1 MHz
JESD-30 Code
R-PDIP-T8
R-PDSO-G8
JESD-609 Code
e3
e3
Length
9.2 mm
4.9 mm
Memory Density
16384 bit
16384 bit
Memory IC Type
EEPROM
EEPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
8
8
Number of Words
2048 words
2048 words
Number of Words Code
2000
2000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
2KX8
2KX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE
Parallel/Serial
SERIAL
SERIAL
Qualification Status
Not Qualified
Not Qualified
Serial Bus Type
SPI
SPI
Supply Current-Max
0.005 mA
0.005 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
1.8 V
1.8 V
Supply Voltage-Nom (Vsup)
2.5 V
2.5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
MATTE TIN
Matte Tin (Sn)
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Position
DUAL
DUAL
Width
7.62 mm
3.9 mm
Write Cycle Time-Max (tWC)
5 ms
5 ms
Base Number Matches
1
1
Moisture Sensitivity Level
1
Terminal Pitch
1.27 mm
Compare 25AA160/PB61 with alternatives
Compare 25AA160/SNB63 with alternatives