24LCS21AI/P
vs
M24C01-WBN3T/G
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
STMICROELECTRONICS
Part Package Code
DIP
DIP
Package Description
0.300 INCH, ROHS COMPLIANT, PLASTIC, DIP-8
DIP,
Pin Count
8
8
Reach Compliance Code
compliant
compliant
Clock Frequency-Max (fCLK)
0.1 MHz
0.4 MHz
JESD-30 Code
R-PDIP-T8
R-PDIP-T8
JESD-609 Code
e3
e3
Length
9.46 mm
9.27 mm
Memory Density
1024 bit
1024 bit
Memory IC Type
EEPROM
EEPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
8
8
Number of Words
128 words
128 words
Number of Words Code
128
128
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
128X8
128X8
Output Characteristics
OPEN-DRAIN
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
SERIAL
SERIAL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.32 mm
5.33 mm
Serial Bus Type
I2C
I2C
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
2.5 V
2.5 V
Supply Voltage-Nom (Vsup)
3 V
3.3 V
Surface Mount
NO
NO
Technology
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Finish
MATTE TIN
MATTE TIN
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
NOT SPECIFIED
Width
7.62 mm
7.62 mm
Write Cycle Time-Max (tWC)
10 ms
10 ms
Base Number Matches
1
1
Moisture Sensitivity Level
NOT APPLICABLE
Compare 24LCS21AI/P with alternatives
Compare M24C01-WBN3T/G with alternatives