24LC32AT-I/SN
vs
S29AS016J70BFI033
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
CYPRESS SEMICONDUCTOR CORP
|
Part Package Code |
SOIC
|
|
Pin Count |
8
|
|
Reach Compliance Code |
compliant
|
compliant
|
Samacsys Manufacturer |
Microchip
|
|
Additional Feature |
2-WIRE SERIAL INTERFACE; DATA RETENTION > 200 YEARS; 1000000 ERASE/WRITE CYCLES GUARANTEED
|
TOP BOOT BLOCK
|
Clock Frequency-Max (fCLK) |
0.4 MHz
|
|
Data Retention Time-Min |
200
|
|
Endurance |
1000000 Write/Erase Cycles
|
|
I2C Control Byte |
1010DDDR
|
|
JESD-30 Code |
R-PDSO-G8
|
R-PBGA-B48
|
JESD-609 Code |
e3
|
|
Length |
4.9 mm
|
8.15 mm
|
Memory Density |
32768 bit
|
16777216 bit
|
Memory IC Type |
EEPROM
|
FLASH
|
Memory Width |
8
|
16
|
Moisture Sensitivity Level |
1
|
3
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
48
|
Number of Words |
4096 words
|
1048576 words
|
Number of Words Code |
4000
|
1000000
|
Operating Mode |
SYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Organization |
4KX8
|
1MX16
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
VFBGA
|
Package Equivalence Code |
SOP8,.25
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
Parallel/Serial |
SERIAL
|
PARALLEL
|
Peak Reflow Temperature (Cel) |
260
|
|
Power Supplies |
3/5 V
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.75 mm
|
1 mm
|
Serial Bus Type |
I2C
|
|
Standby Current-Max |
0.000001 A
|
|
Supply Current-Max |
0.003 mA
|
|
Supply Voltage-Max (Vsup) |
5.5 V
|
1.95 V
|
Supply Voltage-Min (Vsup) |
2.5 V
|
1.65 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
1.8 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
Matte Tin (Sn)
|
|
Terminal Form |
GULL WING
|
BALL
|
Terminal Pitch |
1.27 mm
|
0.8 mm
|
Terminal Position |
DUAL
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
60
|
|
Width |
3.9 mm
|
6.15 mm
|
Write Cycle Time-Max (tWC) |
5 ms
|
|
Write Protection |
HARDWARE
|
|
Base Number Matches |
1
|
3
|
ECCN Code |
|
EAR99
|
HTS Code |
|
8542.32.00.51
|
Access Time-Max |
|
70 ns
|
Alternate Memory Width |
|
8
|
Boot Block |
|
TOP
|
Programming Voltage |
|
1.8 V
|
Type |
|
NOR TYPE
|
|
|
|
Compare 24LC32AT-I/SN with alternatives
Compare S29AS016J70BFI033 with alternatives