24LC256-I/SN
vs
24LC256-I/MSG
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Part Package Code |
SOIC
|
MSOP
|
Pin Count |
8
|
8
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.51
|
8542.32.00.51
|
Factory Lead Time |
32 Weeks, 4 Days
|
|
Samacsys Manufacturer |
Microchip
|
|
Clock Frequency-Max (fCLK) |
0.4 MHz
|
0.4 MHz
|
Data Retention Time-Min |
200
|
200
|
Endurance |
1000000 Write/Erase Cycles
|
1000000 Write/Erase Cycles
|
I2C Control Byte |
1010DDDR
|
1010DDDR
|
JESD-30 Code |
R-PDSO-G8
|
S-PDSO-G8
|
JESD-609 Code |
e3
|
e3
|
Length |
4.9 mm
|
3 mm
|
Memory Density |
262144 bit
|
262144 bit
|
Memory IC Type |
EEPROM
|
EEPROM
|
Memory Width |
8
|
8
|
Moisture Sensitivity Level |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Ports |
1
|
|
Number of Terminals |
8
|
8
|
Number of Words |
32768 words
|
32768 words
|
Number of Words Code |
32000
|
32000
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Organization |
32KX8
|
32KX8
|
Output Characteristics |
OPEN-DRAIN
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
TSSOP
|
Package Equivalence Code |
SOP8,.23
|
TSSOP8,.19
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Parallel/Serial |
SERIAL
|
SERIAL
|
Peak Reflow Temperature (Cel) |
260
|
|
Programming Voltage |
4.5 V
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Reverse Pinout |
NO
|
NO
|
Screening Level |
AEC-Q100
|
|
Seated Height-Max |
1.75 mm
|
1.1 mm
|
Serial Bus Type |
I2C
|
I2C
|
Standby Current-Max |
0.000005 A
|
0.000001 A
|
Supply Current-Max |
0.003 mA
|
0.003 mA
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
2.5 V
|
2.5 V
|
Supply Voltage-Nom (Vsup) |
4.5 V
|
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
MATTE TIN
|
Matte Tin (Sn)
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
0.65 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
3.9 mm
|
3 mm
|
Write Cycle Time-Max (tWC) |
5 ms
|
5 ms
|
Write Protection |
HARDWARE
|
HARDWARE
|
Base Number Matches |
4
|
1
|
Package Description |
|
MSOP-8
|
|
|
|
Compare 24LC256-I/SN with alternatives
Compare 24LC256-I/MSG with alternatives