24LC08B-E/MS
vs
11LC080-I/P
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Part Package Code |
MSOP
|
DIP
|
Package Description |
ROHS COMPLIANT, PLASTIC, MSOP-8
|
0.300 INCH, ROHS COMPLIANT, PLASTIC, DIP-8
|
Pin Count |
8
|
8
|
Reach Compliance Code |
compliant
|
compliant
|
Factory Lead Time |
5 Weeks
|
5 Weeks
|
Samacsys Manufacturer |
Microchip
|
Microchip
|
Clock Frequency-Max (fCLK) |
0.4 MHz
|
1 MHz
|
Data Retention Time-Min |
200
|
200
|
Endurance |
1000000 Write/Erase Cycles
|
1000000 Write/Erase Cycles
|
I2C Control Byte |
1010XMMR
|
|
JESD-30 Code |
S-PDSO-G8
|
R-PDIP-T8
|
JESD-609 Code |
e3
|
e3
|
Length |
3 mm
|
9.271 mm
|
Memory Density |
8192 bit
|
8192 bit
|
Memory IC Type |
EEPROM
|
EEPROM
|
Memory Width |
8
|
8
|
Moisture Sensitivity Level |
1
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
8
|
Number of Words |
1024 words
|
1024 words
|
Number of Words Code |
1000
|
1000
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Organization |
1KX8
|
1KX8
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSSOP
|
DIP
|
Package Equivalence Code |
TSSOP8,.19
|
DIP8,.3
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
IN-LINE
|
Parallel/Serial |
SERIAL
|
SERIAL
|
Peak Reflow Temperature (Cel) |
260
|
|
Power Supplies |
3/5 V
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.1 mm
|
5.334 mm
|
Serial Bus Type |
I2C
|
1-WIRE
|
Standby Current-Max |
0.000005 A
|
0.000005 A
|
Supply Current-Max |
0.003 mA
|
0.005 mA
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
2.5 V
|
2.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
Terminal Finish |
Matte Tin (Sn)
|
MATTE TIN
|
Terminal Form |
GULL WING
|
THROUGH-HOLE
|
Terminal Pitch |
0.65 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
40
|
|
Width |
3 mm
|
7.62 mm
|
Write Cycle Time-Max (tWC) |
5 ms
|
10 ms
|
Write Protection |
HARDWARE
|
SOFTWARE
|
Base Number Matches |
1
|
1
|
ECCN Code |
|
EAR99
|
HTS Code |
|
8542.32.00.51
|
Number of Ports |
|
1
|
Output Characteristics |
|
TOTEM POLE
|
Ready/Busy |
|
NO
|
Reverse Pinout |
|
NO
|
Screening Level |
|
AEC-Q100
|
Toggle Bit |
|
NO
|
|
|
|
Compare 24LC08B-E/MS with alternatives
Compare 11LC080-I/P with alternatives