24LC02B/MT
vs
M24C02-WDW6G
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
STMICROELECTRONICS
Part Package Code
DIE
SOIC
Package Description
MICRO, DIE-4
TSSOP, TSSOP8,.25
Pin Count
4
8
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Clock Frequency-Max (fCLK)
0.1 MHz
0.4 MHz
Data Retention Time-Min
200
40
Endurance
1000000 Write/Erase Cycles
1000000 Write/Erase Cycles
I2C Control Byte
1010XXXR
1010DDDR
JESD-30 Code
R-XUUC-N4
R-PDSO-G8
JESD-609 Code
e3
e4
Memory Density
2048 bit
2048 bit
Memory IC Type
EEPROM
EEPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
4
8
Number of Words
256 words
256 words
Number of Words Code
256
256
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
256X8
256X8
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Code
DIE
TSSOP
Package Equivalence Code
MODULE,8LEAD,.46
TSSOP8,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
UNCASED CHIP
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial
SERIAL
SERIAL
Qualification Status
Not Qualified
Not Qualified
Serial Bus Type
I2C
I2C
Standby Current-Max
0.0001 A
0.000001 A
Supply Current-Max
0.003 mA
0.002 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
2.5 V
2.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
MATTE TIN
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
NO LEAD
GULL WING
Terminal Position
UPPER
DUAL
Write Cycle Time-Max (tWC)
10 ms
5 ms
Base Number Matches
1
1
Length
4.4 mm
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
260
Seated Height-Max
1.2 mm
Terminal Pitch
0.65 mm
Time@Peak Reflow Temperature-Max (s)
30
Width
3 mm
Write Protection
HARDWARE
Compare 24LC02B/MT with alternatives
Compare M24C02-WDW6G with alternatives