24LC01BH-E/MNY vs M24C01-WBN3P/G feature comparison

24LC01BH-E/MNY Microchip Technology Inc

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M24C01-WBN3P/G STMicroelectronics

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Rohs Code Yes Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer MICROCHIP TECHNOLOGY INC STMICROELECTRONICS
Part Package Code DFN DIP
Package Description 2 X 3 MM, 0.75 MM HEIGHT, PLASTIC, TDFN-8 DIP, DIP8,.3
Pin Count 8 8
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Clock Frequency-Max (fCLK) 0.4 MHz 0.4 MHz
Data Retention Time-Min 200 40
Endurance 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles
I2C Control Byte 1010XXXR 1010DDDR
JESD-30 Code R-PDSO-N8 R-PDIP-T8
Length 3 mm 9.27 mm
Memory Density 1024 bit 1024 bit
Memory IC Type EEPROM EEPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 128 words 128 words
Number of Words Code 128 128
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Organization 128X8 128X8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HVSON DIP
Package Equivalence Code SOLCC8,.11,20 DIP8,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Parallel/Serial SERIAL SERIAL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 0.8 mm 5.33 mm
Serial Bus Type I2C I2C
Standby Current-Max 0.000001 A 0.000002 A
Supply Current-Max 0.003 mA 0.003 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 2.5 V 2.5 V
Supply Voltage-Nom (Vsup) 4.5 V 3.3 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Form NO LEAD THROUGH-HOLE
Terminal Pitch 0.5 mm 2.54 mm
Terminal Position DUAL DUAL
Width 2 mm 7.62 mm
Write Cycle Time-Max (tWC) 5 ms 10 ms
Write Protection HARDWARE HARDWARE
Base Number Matches 1 1
Pbfree Code Yes
JESD-609 Code e3
Terminal Finish MATTE TIN

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