24LC01BH-E/MNY
vs
M24C01-WBN3P/G
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
STMICROELECTRONICS
Part Package Code
DFN
DIP
Package Description
2 X 3 MM, 0.75 MM HEIGHT, PLASTIC, TDFN-8
DIP, DIP8,.3
Pin Count
8
8
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Clock Frequency-Max (fCLK)
0.4 MHz
0.4 MHz
Data Retention Time-Min
200
40
Endurance
1000000 Write/Erase Cycles
1000000 Write/Erase Cycles
I2C Control Byte
1010XXXR
1010DDDR
JESD-30 Code
R-PDSO-N8
R-PDIP-T8
Length
3 mm
9.27 mm
Memory Density
1024 bit
1024 bit
Memory IC Type
EEPROM
EEPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
8
8
Number of Words
128 words
128 words
Number of Words Code
128
128
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
128X8
128X8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HVSON
DIP
Package Equivalence Code
SOLCC8,.11,20
DIP8,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Parallel/Serial
SERIAL
SERIAL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
0.8 mm
5.33 mm
Serial Bus Type
I2C
I2C
Standby Current-Max
0.000001 A
0.000002 A
Supply Current-Max
0.003 mA
0.003 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
2.5 V
2.5 V
Supply Voltage-Nom (Vsup)
4.5 V
3.3 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Form
NO LEAD
THROUGH-HOLE
Terminal Pitch
0.5 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
2 mm
7.62 mm
Write Cycle Time-Max (tWC)
5 ms
10 ms
Write Protection
HARDWARE
HARDWARE
Base Number Matches
1
1
Pbfree Code
JESD-609 Code
e3
Terminal Finish
MATTE TIN
Compare 24LC01BH-E/MNY with alternatives
Compare M24C01-WBN3P/G with alternatives