24FC16-E/P
vs
24FC16H-I/SN
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
DIP, DIP8,.3
|
SOIC-8
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.51
|
8542.32.00.51
|
Factory Lead Time |
6 Weeks
|
5 Weeks
|
Date Of Intro |
2019-12-11
|
2019-12-11
|
Samacsys Manufacturer |
Microchip
|
Microchip
|
Clock Frequency-Max (fCLK) |
1 MHz
|
1 MHz
|
Data Retention Time-Min |
200
|
200
|
Endurance |
1000000 Write/Erase Cycles
|
1000000 Write/Erase Cycles
|
I2C Control Byte |
1010MMMR
|
1010MMMR
|
JESD-30 Code |
R-PDIP-T8
|
R-PDSO-G8
|
Length |
9.271 mm
|
4.9 mm
|
Memory Density |
16384 bit
|
16384 bit
|
Memory IC Type |
EEPROM
|
EEPROM
|
Memory Width |
8
|
8
|
Number of Functions |
1
|
1
|
Number of Ports |
1
|
1
|
Number of Terminals |
8
|
8
|
Number of Words |
2048 words
|
2048 words
|
Number of Words Code |
2000
|
2000
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Organization |
2KX8
|
2KX8
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
SOP
|
Package Equivalence Code |
DIP8,.3
|
SOP8,.23
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
SMALL OUTLINE
|
Parallel/Serial |
SERIAL
|
SERIAL
|
Programming Voltage |
2.5 V
|
2.5 V
|
Screening Level |
AEC-Q100
|
|
Seated Height-Max |
5.334 mm
|
1.75 mm
|
Serial Bus Type |
I2C
|
I2C
|
Standby Current-Max |
0.000003 A
|
0.000003 A
|
Supply Current-Max |
0.003 mA
|
0.003 mA
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
1.7 V
|
1.7 V
|
Supply Voltage-Nom (Vsup) |
2.5 V
|
2.5 V
|
Surface Mount |
NO
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
Terminal Form |
THROUGH-HOLE
|
GULL WING
|
Terminal Pitch |
2.54 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
7.62 mm
|
3.9 mm
|
Write Cycle Time-Max (tWC) |
5 ms
|
5 ms
|
Write Protection |
HARDWARE
|
HARDWARE
|
Base Number Matches |
1
|
1
|
JESD-609 Code |
|
e3
|
Moisture Sensitivity Level |
|
1
|
Output Characteristics |
|
OPEN-DRAIN
|
Peak Reflow Temperature (Cel) |
|
260
|
Terminal Finish |
|
Matte Tin (Sn)
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare 24FC16-E/P with alternatives
Compare 24FC16H-I/SN with alternatives