24C04AI/P vs M24C04-BN3T/W feature comparison

24C04AI/P Microchip Technology Inc

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M24C04-BN3T/W STMicroelectronics

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICROCHIP TECHNOLOGY INC STMICROELECTRONICS
Part Package Code DIP DIP
Package Description DIP, PLASTIC, DIP-8
Pin Count 8 8
Reach Compliance Code unknown compliant
Clock Frequency-Max (fCLK) 0.1 MHz 0.4 MHz
JESD-30 Code R-PDIP-T8 R-PDIP-T8
JESD-609 Code e0 e0
Length 9.46 mm 9.27 mm
Memory Density 4096 bit 4096 bit
Memory IC Type EEPROM EEPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 512 words 512 words
Number of Words Code 512 512
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Organization 512X8 512X8
Output Characteristics OPEN-DRAIN
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.32 mm 5.33 mm
Serial Bus Type I2C I2C
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm 7.62 mm
Write Cycle Time-Max (tWC) 1 ms 10 ms
Base Number Matches 1 1
ECCN Code EAR99
HTS Code 8542.32.00.51

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