24AA128-I/ST
vs
24AA128-I/P
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Active
parentfamilyid
1364656
1364656
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Part Package Code
SOIC
DIP
Package Description
ROHS COMPLIANT, PLASTIC, TSSOP-8
0.300 INCH, ROHS COMPLIANT, PLASTIC, DIP-8
Pin Count
8
8
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Factory Lead Time
8 Weeks, 3 Days
6 Weeks
Samacsys Description
Microchip 24AA128-I/ST, 128kb EEPROM Memory, 3500ns 8-Pin TSSOP Serial-2 Wire, Serial-I2C
Microchip 24AA128-I/P Serial EEPROM Memory, 128kbit, 900ns, 1.7 → 5.5 V 8-Pin PDIP
Samacsys Manufacturer
Microchip
Microchip
Samacsys Modified On
2023-03-07 16:10:32
2023-03-07 16:10:32
Total Weight
33
486.7
Category CO2 Kg
12
12
CO2
396
5840.4
Compliance Temperature Grade
Industrial: -40C to +85C
Industrial: -40C to +85C
EU RoHS Version
RoHS 2 (2015/863/EU)
RoHS 2 (2015/863/EU)
Candidate List Date
2024-01-23
2024-01-23
CAS Accounted for Wt
93
100
CA Prop 65 Presence
YES
YES
CA Prop 65 CAS Numbers
7440-02-0, 1333-86-4
1333-86-4, 1309-64-4
EFUP
e
e
Conflict Mineral Status
DRC Conflict Free
DRC Conflict Free
Conflict Mineral Status Source
CMRT V6.22
CMRT V6.22
Qualifications
AEC-Q100
AEC-Q100
Clock Frequency-Max (fCLK)
0.4 MHz
0.4 MHz
Data Retention Time-Min
200
200
Endurance
1000000 Write/Erase Cycles
1000000 Write/Erase Cycles
I2C Control Byte
1010DDDR
1010DDDR
JESD-30 Code
R-PDSO-G8
R-PDIP-T8
JESD-609 Code
e3
e3
Length
4.4 mm
9.271 mm
Memory Density
131072 bit
131072 bit
Memory IC Type
EEPROM
EEPROM
Memory Width
8
8
Moisture Sensitivity Level
1
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
8
8
Number of Words
16384 words
16384 words
Number of Words Code
16000
16000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
16KX8
16KX8
Output Characteristics
OPEN-DRAIN
OPEN-DRAIN
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
DIP
Package Equivalence Code
TSSOP8,.25
DIP8,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
IN-LINE
Parallel/Serial
SERIAL
SERIAL
Peak Reflow Temperature (Cel)
260
Programming Voltage
2.5 V
2.5 V
Qualification Status
Not Qualified
Not Qualified
Screening Level
AEC-Q100
AEC-Q100
Seated Height-Max
1.2 mm
5.334 mm
Serial Bus Type
I2C
I2C
Standby Current-Max
0.000005 A
0.000005 A
Supply Current-Max
0.003 mA
0.003 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
1.7 V
1.7 V
Supply Voltage-Nom (Vsup)
2.5 V
2.5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Matte Tin (Sn)
MATTE TIN
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
0.65 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
40
Width
3 mm
7.62 mm
Write Cycle Time-Max (tWC)
5 ms
5 ms
Write Protection
HARDWARE
HARDWARE
Base Number Matches
1
1
kg CO2e/kg
12
Average Weight (mg)
569.675
CO2e (mg)
6836.1
Compare 24AA128-I/ST with alternatives
Compare 24AA128-I/P with alternatives