23S08-1HDCG8
vs
PI6C3Q991-2JX
feature comparison
Pbfree Code |
Yes
|
No
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
PERICOM SEMICONDUCTOR CORP
|
Part Package Code |
SOIC
|
QFJ
|
Package Description |
GREEN, SOIC-16
|
QCCJ, LDCC32,.5X.6
|
Pin Count |
16
|
32
|
Manufacturer Package Code |
DCG16
|
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
23S
|
6C
|
Input Conditioning |
MUX
|
STANDARD
|
JESD-30 Code |
R-PDSO-G16
|
R-PQCC-J32
|
JESD-609 Code |
e3
|
e0
|
Logic IC Type |
PLL BASED CLOCK DRIVER
|
PLL BASED CLOCK DRIVER
|
Max I(ol) |
0.012 A
|
0.012 A
|
Moisture Sensitivity Level |
3
|
1
|
Number of Functions |
1
|
1
|
Number of Inverted Outputs |
|
|
Number of Terminals |
16
|
32
|
Number of True Outputs |
8
|
4
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Output Characteristics |
3-STATE
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
QCCJ
|
Package Equivalence Code |
SOP16,.25
|
LDCC32,.5X.6
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
CHIP CARRIER
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Same Edge Skew-Max (tskwd) |
0.2 ns
|
1.2 ns
|
Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
MATTE TIN
|
TIN LEAD
|
Terminal Form |
GULL WING
|
J BEND
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
fmax-Min |
133.3 MHz
|
85 MHz
|
Base Number Matches |
2
|
1
|
Length |
|
13.97 mm
|
Prop. Delay@Nom-Sup |
|
0.25 ns
|
Seated Height-Max |
|
3.556 mm
|
Width |
|
11.43 mm
|
|
|
|
Compare 23S08-1HDCG8 with alternatives
Compare PI6C3Q991-2JX with alternatives