23LCV512-I/ST
vs
N01S830BAT22ET
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
ON SEMICONDUCTOR
Package Description
TSSOP-8
TSSOP,
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.41
Samacsys Manufacturer
Microchip
onsemi
Clock Frequency-Max (fCLK)
20 MHz
I/O Type
COMMON
JESD-30 Code
R-PDSO-G8
R-PDSO-G8
JESD-609 Code
e3
e3
Length
4.4 mm
4.4 mm
Memory Density
524288 bit
1048576 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
8
8
Moisture Sensitivity Level
1
3
Number of Functions
1
1
Number of Ports
1
Number of Terminals
8
8
Number of Words
65536 words
131072 words
Number of Words Code
64000
128000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
64KX8
128KX8
Output Characteristics
3-STATE
Output Enable
NO
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
TSSOP
Package Equivalence Code
TSSOP8,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial
SERIAL
SERIAL
Peak Reflow Temperature (Cel)
260
260
Seated Height-Max
1.2 mm
1.1 mm
Standby Current-Max
0.00001 A
Standby Voltage-Min
2.5 V
Supply Current-Max
0.01 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Finish
MATTE TIN
TIN
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
40
30
Width
3 mm
3 mm
Base Number Matches
1
1
Pbfree Code
Part Package Code
TSSOP-8
Manufacturer Package Code
948BJ
Date Of Intro
2016-02-05
Compare 23LCV512-I/ST with alternatives
Compare N01S830BAT22ET with alternatives