23K640-I/P
vs
CY14MB064Q2B-SXIT
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
CYPRESS SEMICONDUCTOR CORP
Part Package Code
DIP
Package Description
0.300 INCH, HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, DIP-8
SOIC-8
Pin Count
8
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.41
Factory Lead Time
6 Weeks
Samacsys Manufacturer
Microchip
Clock Frequency-Max (fCLK)
20 MHz
I/O Type
SEPARATE
JESD-30 Code
R-PDIP-T8
R-PDSO-G8
JESD-609 Code
e3
e4
Length
9.271 mm
4.889 mm
Memory Density
65536 bit
65536 bit
Memory IC Type
STANDARD SRAM
NON-VOLATILE SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Ports
1
Number of Terminals
8
8
Number of Words
8192 words
8192 words
Number of Words Code
8000
8000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
8KX8
8KX8
Output Characteristics
3-STATE
Output Enable
NO
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
SOP
Package Equivalence Code
DIP8,.3
SOP8,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE
Parallel/Serial
SERIAL
SERIAL
Qualification Status
Not Qualified
Not Qualified
Screening Level
TS 16949
Seated Height-Max
5.334 mm
1.727 mm
Standby Current-Max
0.000004 A
0.00012 A
Standby Voltage-Min
2.7 V
Supply Current-Max
0.01 mA
0.003 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
MATTE TIN
NICKEL PALLADIUM GOLD
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
3.8985 mm
Base Number Matches
1
1
Moisture Sensitivity Level
3
Compare 23K640-I/P with alternatives
Compare CY14MB064Q2B-SXIT with alternatives