23K256-IST-I/ST
vs
N25S830HAS22I
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
ONSEMI
Part Package Code
SOIC
SOIC-8 Narrow Body
Package Description
4.40 MM, HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, TSSOP-8
0.150 INCH, GREEN, PLASTIC, SOIC-8
Pin Count
8
8
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
JESD-30 Code
R-PDSO-G8
R-PDSO-G8
Length
4.4 mm
4.9 mm
Memory Density
262144 bit
262144 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
8
8
Number of Words
32768 words
32768 words
Number of Words Code
32000
32000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
32KX8
32KX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Parallel/Serial
SERIAL
SERIAL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.75 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
3 mm
3.91 mm
Base Number Matches
1
1
Pbfree Code
Manufacturer Package Code
751AZ
Factory Lead Time
11 Weeks, 1 Day
Samacsys Manufacturer
onsemi
Clock Frequency-Max (fCLK)
20 MHz
I/O Type
SEPARATE
JESD-609 Code
e3
Moisture Sensitivity Level
3
Number of Ports
1, (3 LINE)
Output Characteristics
3-STATE
Package Equivalence Code
SOP8,.25
Peak Reflow Temperature (Cel)
260
Standby Current-Max
0.000004 A
Standby Voltage-Min
2.7 V
Supply Current-Max
0.01 mA
Terminal Finish
MATTE TIN
Time@Peak Reflow Temperature-Max (s)
30
Compare 23K256-IST-I/ST with alternatives
Compare N25S830HAS22I with alternatives