23K256-E/SN
vs
23K256T-I/P
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Part Package Code
SOIC
DIP
Package Description
3.90 MM, HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, SOIC-8
0.300 INCH, HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, DIP-8
Pin Count
8
8
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.41
Factory Lead Time
4 Weeks
Samacsys Manufacturer
Microchip
Clock Frequency-Max (fCLK)
16 MHz
I/O Type
SEPARATE
JESD-30 Code
R-PDSO-G8
R-PDIP-T8
JESD-609 Code
e3
e3
Length
4.9 mm
9.271 mm
Memory Density
262144 bit
262144 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
8
8
Moisture Sensitivity Level
1
Number of Functions
1
1
Number of Ports
1
Number of Terminals
8
8
Number of Words
32768 words
32768 words
Number of Words Code
32000
32000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
32KX8
32KX8
Output Characteristics
3-STATE
Output Enable
NO
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
DIP
Package Equivalence Code
SOP8,.23
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Parallel/Serial
SERIAL
SERIAL
Peak Reflow Temperature (Cel)
260
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
5.334 mm
Standby Current-Max
0.00001 A
Standby Voltage-Min
2.7 V
Supply Current-Max
0.01 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Finish
MATTE TIN
Matte Tin (Sn)
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
3.9 mm
7.62 mm
Base Number Matches
1
1
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare 23K256-E/SN with alternatives
Compare 23K256T-I/P with alternatives