23A256-IST-I/ST
vs
CY14MB256J2-SXI
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
CYPRESS SEMICONDUCTOR CORP
Part Package Code
SOIC
SOIC
Package Description
4.40 MM, HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, TSSOP-8
0.150 INCH, ROHS COMPLIANT, MS-012, SOIC-8
Pin Count
8
8
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
JESD-30 Code
R-PDSO-G8
R-PDSO-G8
Length
4.4 mm
4.889 mm
Memory Density
262144 bit
262144 bit
Memory IC Type
STANDARD SRAM
NON-VOLATILE SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
8
8
Number of Words
32768 words
32768 words
Number of Words Code
32000
32000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
32KX8
32KX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Parallel/Serial
SERIAL
SERIAL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.727 mm
Supply Voltage-Max (Vsup)
1.95 V
3.6 V
Supply Voltage-Min (Vsup)
1.7 V
2.7 V
Supply Voltage-Nom (Vsup)
1.8 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
3 mm
3.8985 mm
Base Number Matches
1
1
Pbfree Code
Rohs Code
JESD-609 Code
e4
Moisture Sensitivity Level
3
Package Equivalence Code
SOP8,.25
Peak Reflow Temperature (Cel)
260
Standby Current-Max
0.00015 A
Supply Current-Max
0.003 mA
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare 23A256-IST-I/ST with alternatives
Compare CY14MB256J2-SXI with alternatives