2308B-1HPGG8
vs
IDT2308B-1HPGGI8
feature comparison
All Stats
Differences Only
Pbfree Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
RENESAS ELECTRONICS CORP
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
TSSOP
TSSOP
Package Description
TSSOP, TSSOP16,.25
TSSOP,
Pin Count
16
16
Manufacturer Package Code
PGG16
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Samacsys Manufacturer
Renesas Electronics
Family
2308
2308
Input Conditioning
STANDARD
STANDARD
JESD-30 Code
R-PDSO-G16
R-PDSO-G16
JESD-609 Code
e3
e3
Length
5 mm
5 mm
Logic IC Type
PLL BASED CLOCK DRIVER
PLL BASED CLOCK DRIVER
Max I(ol)
0.012 A
Moisture Sensitivity Level
1
1
Number of Functions
1
1
Number of Inverted Outputs
Number of Terminals
16
16
Number of True Outputs
8
8
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
TSSOP
Package Equivalence Code
TSSOP16,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method
TR
Peak Reflow Temperature (Cel)
260
260
Power Supply Current-Max (ICC)
70 mA
Qualification Status
Not Qualified
Not Qualified
Same Edge Skew-Max (tskwd)
0.2 ns
0.2 ns
Seated Height-Max
1.2 mm
1.2 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
MATTE TIN
Matte Tin (Sn) - annealed
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
30
Width
4.4 mm
4.4 mm
fmax-Min
133.3 MHz
133.3 MHz
Base Number Matches
2
1
Rohs Code
Compare 2308B-1HPGG8 with alternatives
Compare IDT2308B-1HPGGI8 with alternatives