2308B-1DCGI
vs
PI6C2305-1HLEX
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
PERICOM SEMICONDUCTOR CORP
Part Package Code
SOIC
SOIC
Package Description
SOIC-16
TSSOP,
Pin Count
16
8
Manufacturer Package Code
DCG16
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Family
2308
6C
Input Conditioning
STANDARD
STANDARD
JESD-30 Code
R-PDSO-G16
R-PDSO-G8
JESD-609 Code
e3
e3
Length
9.9314 mm
4.4 mm
Logic IC Type
PLL BASED CLOCK DRIVER
PLL BASED CLOCK DRIVER
Max I(ol)
0.008 A
Moisture Sensitivity Level
3
1
Number of Functions
1
1
Number of Inverted Outputs
Number of Terminals
16
8
Number of True Outputs
8
5
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
TSSOP
Package Equivalence Code
SOP16,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Same Edge Skew-Max (tskwd)
0.4 ns
0.2 ns
Seated Height-Max
1.7272 mm
1.2 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
MATTE TIN
MATTE TIN
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
0.65 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
3.937 mm
3 mm
fmax-Min
133.3 MHz
133 MHz
Base Number Matches
2
1
Compare 2308B-1DCGI with alternatives
Compare PI6C2305-1HLEX with alternatives