2305NZ-1HDCG
vs
PL123-09SIA-R
feature comparison
| Pbfree Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
SOIC
|
|
| Package Description |
SOP, SOP8,.25
|
SOP, SOP16,.25
|
| Pin Count |
8
|
|
| Manufacturer Package Code |
DCG8
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
12 Weeks
|
|
| Samacsys Manufacturer |
Renesas Electronics
|
|
| Family |
2305
|
|
| Input Conditioning |
STANDARD
|
STANDARD
|
| JESD-30 Code |
R-PDSO-G8
|
R-PDSO-G16
|
| JESD-609 Code |
e3
|
|
| Logic IC Type |
LOW SKEW CLOCK DRIVER
|
LOW SKEW CLOCK DRIVER
|
| Max I(ol) |
0.012 A
|
0.012 A
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
1
|
| Number of Inverted Outputs |
|
|
| Number of Terminals |
8
|
16
|
| Number of True Outputs |
5
|
9
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Equivalence Code |
SOP8,.25
|
SOP16,.25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Packing Method |
TUBE
|
TR
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Propagation Delay (tpd) |
8.7 ns
|
0.35 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Same Edge Skew-Max (tskwd) |
0.25 ns
|
0.25 ns
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| fmax-Min |
133.33 MHz
|
10 MHz
|
| Base Number Matches |
2
|
2
|
| Rohs Code |
|
Yes
|
| Length |
|
9.9 mm
|
| Load Capacitance (CL) |
|
30 pF
|
| Power Supply Current-Max (ICC) |
|
45 mA
|
| Prop. Delay@Nom-Sup |
|
0.35 ns
|
| Seated Height-Max |
|
1.75 mm
|
| Technology |
|
CMOS
|
| Width |
|
3.9 mm
|
|
|
|
Compare 2305NZ-1HDCG with alternatives
Compare PL123-09SIA-R with alternatives