2305MI-1HLF
vs
IDT2309B-1HDC
feature comparison
All Stats
Differences Only
Pbfree Code
Yes
No
Rohs Code
Yes
No
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
SOIC
SOIC
Package Description
0.150 INCH, LEAD FREE, SOIC-8
SOIC-16
Pin Count
8
16
Manufacturer Package Code
DCG8
Reach Compliance Code
compliant
not_compliant
ECCN Code
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Family
2305
2309
Input Conditioning
STANDARD
STANDARD
JESD-30 Code
R-PDSO-G8
R-PDSO-G16
JESD-609 Code
e3
e0
Length
4.9 mm
9.9314 mm
Logic IC Type
PLL BASED CLOCK DRIVER
PLL BASED CLOCK DRIVER
Max I(ol)
0.012 A
Moisture Sensitivity Level
1
1
Number of Functions
1
1
Number of Inverted Outputs
Number of Terminals
8
16
Number of True Outputs
4
8
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Equivalence Code
SOP8,.25
SOP16,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Peak Reflow Temperature (Cel)
260
240
Qualification Status
Not Qualified
Not Qualified
Same Edge Skew-Max (tskwd)
0.25 ns
0.25 ns
Seated Height-Max
1.75 mm
1.7272 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
MATTE TIN
TIN LEAD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
30
Width
3.9 mm
3.937 mm
fmax-Min
133 MHz
133 MHz
Base Number Matches
2
1
Compare 2305MI-1HLF with alternatives
Compare IDT2309B-1HDC with alternatives