201007F1203T4E vs RS10K124FBG feature comparison

201007F1203T4E Royal Electronic Factory (Thailand) Co Ltd

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RS10K124FBG Fenghua (HK) Electronics Ltd

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Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer ROYAL ELECTRONIC FTY CO LTD FENGHUA ADVANCED TECHNOLOGY
Package Description CHIP CHIP
Reach Compliance Code compliant unknown
Construction Rectangular RECTANGULAR PACKAGE
JESD-609 Code e3
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.55 mm 0.55 mm
Package Length 5 mm 5 mm
Package Style SMT SMT
Package Width 2.5 mm 2.5 mm
Packing Method TR, EMBOSSED PAPER, 7 INCH Bulk
Rated Power Dissipation (P) 0.75 W 0.75 W
Rated Temperature 70 °C 70 °C
Resistance 120000 Ω 120000 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 2010 2010
Surface Mount YES YES
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 100 ppm/°C 100 ppm/°C
Terminal Finish TIN OVER NICKEL
Terminal Shape WRAPAROUND WRAPAROUND
Tolerance 1% 1%
Working Voltage 200 V 200 V
Base Number Matches 1 1
ECCN Code EAR99
HTS Code 8533.21.00.30
Package Shape RECTANGULAR PACKAGE

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Compare RS10K124FBG with alternatives