200B223MP50XC100
vs
200B223MWN50XC
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
KYOCERA AVX COMPONENTS CORP
|
AMERICAN TECHNICAL CERAMICS CORP
|
| Package Description |
CHIP
|
, 1111
|
| Reach Compliance Code |
compliant
|
compliant
|
| Capacitance |
0.022 µF
|
0.022 µF
|
| Capacitor Type |
CERAMIC CAPACITOR
|
CERAMIC CAPACITOR
|
| Dielectric Material |
CERAMIC
|
CERAMIC
|
| Height |
2.59 mm
|
2.59 mm
|
| JESD-609 Code |
e0
|
e0
|
| Length |
2.79 mm
|
2.79 mm
|
| Mounting Feature |
SURFACE MOUNT
|
SURFACE MOUNT
|
| Multilayer |
Yes
|
Yes
|
| Negative Tolerance |
20%
|
20%
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Style |
SMT
|
SMT
|
| Positive Tolerance |
20%
|
20%
|
| Rated (AC) Voltage (URac) |
35.35 V
|
|
| Rated (DC) Voltage (URdc) |
50 V
|
50 V
|
| Size Code |
1111
|
1111
|
| Surface Mount |
YES
|
YES
|
| Temperature Characteristics Code |
BX
|
BX
|
| Temperature Coefficient |
15% ppm/°C
|
15% ppm/°C
|
| Terminal Finish |
Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier
|
Tin/Lead (Sn/Pb)
|
| Terminal Shape |
WRAPAROUND
|
WRAPAROUND
|
| Width |
2.79 mm
|
2.79 mm
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
No
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8532.24.00.20
|
| Package Shape |
|
RECTANGULAR PACKAGE
|
| Packing Method |
|
BULK
|
|
|
|
Compare 200B223MP50XC100 with alternatives
Compare 200B223MWN50XC with alternatives