1SMB9.0AT3
vs
MXP5KE5.0
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ON SEMICONDUCTOR
|
MICROSEMI CORP
|
| Part Package Code |
DO-214
|
DO-41
|
| Package Description |
R-PDSO-C2
|
O-PALF-W2
|
| Pin Count |
2
|
2
|
| Manufacturer Package Code |
CASE 403A-03
|
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.50
|
8541.10.00.50
|
| Additional Feature |
EXCELLENT CLAMPING CAPABILITY, HIGH RELIABILITY, LOW IMPEDANCE
|
|
| Breakdown Voltage-Max |
11.1 V
|
7.3 V
|
| Breakdown Voltage-Min |
10 V
|
6.4 V
|
| Clamping Voltage-Max |
15.4 V
|
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
TRANS VOLTAGE SUPPRESSOR DIODE
|
TRANS VOLTAGE SUPPRESSOR DIODE
|
| JEDEC-95 Code |
DO-214AA
|
DO-204AL
|
| JESD-30 Code |
R-PDSO-C2
|
O-PALF-W2
|
| JESD-609 Code |
e0
|
e0
|
| Moisture Sensitivity Level |
1
|
1
|
| Non-rep Peak Rev Power Dis-Max |
600 W
|
500 W
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
ROUND
|
| Package Style |
SMALL OUTLINE
|
LONG FORM
|
| Peak Reflow Temperature (Cel) |
235
|
|
| Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
| Power Dissipation-Max |
0.55 W
|
1.19 W
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Reference Standard |
UL RECOGNIZED
|
MIL-19500
|
| Rep Pk Reverse Voltage-Max |
9 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
ZENER
|
AVALANCHE
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
C BEND
|
WIRE
|
| Terminal Position |
DUAL
|
AXIAL
|
| Base Number Matches |
6
|
16
|
| Case Connection |
|
ISOLATED
|
| Operating Temperature-Max |
|
150 °C
|
| Operating Temperature-Min |
|
-65 °C
|
|
|
|
Compare 1SMB9.0AT3 with alternatives
Compare MXP5KE5.0 with alternatives