1SMB5939HR4G
vs
3SMBJ5939B-TPX01
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
TAIWAN SEMICONDUCTOR CO LTD
|
MICRO COMMERCIAL COMPONENTS CORP
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8541.10.00.50
|
|
| Configuration |
SINGLE
|
|
| Diode Element Material |
SILICON
|
|
| Diode Type |
ZENER DIODE
|
|
| Dynamic Impedance-Max |
45 Ω
|
|
| JEDEC-95 Code |
DO-214AA
|
|
| JESD-30 Code |
R-PDSO-C2
|
|
| JESD-609 Code |
e3
|
e3
|
| Knee Impedance-Max |
900 Ω
|
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Elements |
1
|
|
| Number of Terminals |
2
|
|
| Operating Temperature-Max |
150 °C
|
|
| Operating Temperature-Min |
-55 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
SMALL OUTLINE
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Polarity |
UNIDIRECTIONAL
|
|
| Power Dissipation-Max |
0.55 W
|
|
| Reference Standard |
AEC-Q101
|
|
| Reference Voltage-Nom |
39 V
|
|
| Reverse Current-Max |
1 µA
|
|
| Reverse Test Voltage |
29.7 V
|
|
| Surface Mount |
YES
|
|
| Technology |
ZENER
|
|
| Terminal Finish |
MATTE TIN
|
Matte Tin (Sn)
|
| Terminal Form |
C BEND
|
|
| Terminal Position |
DUAL
|
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Voltage Tol-Max |
5%
|
|
| Working Test Current |
9.6 mA
|
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare 1SMB5939HR4G with alternatives
Compare 3SMBJ5939B-TPX01 with alternatives