1SMB100AT3
vs
MXLSMBJ100AE3
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
MOTOROLA SEMICONDUCTOR PRODUCTS
|
MICROSEMI CORP
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| Clamping Voltage-Max |
162 V
|
|
| Diode Type |
TRANS VOLTAGE SUPPRESSOR DIODE
|
TRANS VOLTAGE SUPPRESSOR DIODE
|
| JESD-609 Code |
e0
|
e3
|
| Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
| Rep Pk Reverse Voltage-Max |
100 V
|
100 V
|
| Surface Mount |
YES
|
YES
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
MATTE TIN
|
| Base Number Matches |
4
|
2
|
| Pbfree Code |
|
Yes
|
| Part Package Code |
|
DO-214AA
|
| Package Description |
|
ROHS COMPLIANT, PLASTIC, SMBJ, 2 PIN
|
| Pin Count |
|
2
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8541.10.00.50
|
| Samacsys Manufacturer |
|
Microsemi Corporation
|
| Additional Feature |
|
HIGH RELIABILITY
|
| Breakdown Voltage-Max |
|
123 V
|
| Breakdown Voltage-Min |
|
111 V
|
| Configuration |
|
SINGLE
|
| Diode Element Material |
|
SILICON
|
| JEDEC-95 Code |
|
DO-214AA
|
| JESD-30 Code |
|
R-PDSO-J2
|
| Moisture Sensitivity Level |
|
1
|
| Non-rep Peak Rev Power Dis-Max |
|
600 W
|
| Number of Elements |
|
1
|
| Number of Terminals |
|
2
|
| Operating Temperature-Max |
|
150 °C
|
| Operating Temperature-Min |
|
-65 °C
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
|
250
|
| Power Dissipation-Max |
|
1.38 W
|
| Qualification Status |
|
Not Qualified
|
| Technology |
|
AVALANCHE
|
| Terminal Form |
|
J BEND
|
| Terminal Position |
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
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