1N979B
vs
BZV55C51
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
COBHAM PLC
NXP SEMICONDUCTORS
Package Description
HERMETIC SEALED, GLASS PACKAGE-2
O-LELF-R2
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JEDEC-95 Code
DO-35
JESD-30 Code
O-LALF-W2
O-LELF-R2
JESD-609 Code
e0
e3
Number of Elements
1
1
Number of Terminals
2
2
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.5 W
0.4 W
Qualification Status
Not Qualified
Not Qualified
Reference Voltage-Nom
56 V
51 V
Surface Mount
NO
YES
Technology
ZENER
ZENER
Terminal Finish
TIN LEAD
TIN
Terminal Form
WIRE
WRAP AROUND
Terminal Position
AXIAL
END
Voltage Tol-Max
5%
5%
Working Test Current
2.2 mA
2 mA
Base Number Matches
11
11
Pbfree Code
Rohs Code
Pin Count
2
Dynamic Impedance-Max
180 Ω
Moisture Sensitivity Level
1
Operating Temperature-Max
200 °C
Operating Temperature-Min
-65 °C
Peak Reflow Temperature (Cel)
260
Reverse Current-Max
0.05 µA
Time@Peak Reflow Temperature-Max (s)
30
Voltage Temp Coeff-Max
57.2 mV/°C
Compare 1N979B with alternatives
Compare BZV55C51 with alternatives